2026 IEEE INTERNATIONAL CONFERENCE ON EMERGING TRENDS IN ENGINEERING AND COMPUTING (ETECOM)
2nd Edition
Welcome to the IEEE International Conference on Emerging Trends in Engineering and Computing (ETECOM)
On behalf of the Organizing Committee, it is our immense pleasure and honor to invite you to the IEEE International Conference on Emerging Trends in Engineering and Computing (ETECOM).
This conference targets a broad and interdisciplinary audience, including researchers, practitioners, and educators interested in the latest advancements in artificial intelligence, data analytics, wireless communications, networking, cloud and edge computing, cyber-physical systems, security, green computing, GIS, intelligent transportation, smart grids, and engineering education. The focus is on theoretical developments and practical applications, emphasizing innovation, sustainability, and integrating new technologies into various fields.
We are now inviting researchers and students to submit proposals to this conference. Submitted papers should neither be previously published nor under consideration for publication elsewhere.
All submissions will be subject to peer reviews and accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.
Keynote Speakers
To Be Announced
Important Dates
26-06-2026
Paper Submission Deadline
26-08-2026
Acceptance Notification
15-09-2026
Early Bird Registration Deadline
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15-09-2026
Late Registration Deadline & Camera Ready Submission
26/27-10-2026
Conference Date
Conference Tracks
Artificial Intelligence (AI), Machine Learning (ML), and Cybersecurity
Data Science, Data Analytics, Digital Twins Applications, and Business Analytics
Sustainable Communications, Green Communication Systems, Next-Generation Networks and Internet, Optical Networks and Systems, Wireless Communication, Cognitive Radio and AI-Enabled Networks, Cloud Computing and Networking
Internet of Things (IoT), Sensor-Based Technologies, Smart Grid, Robotics, and Edge Computing
Smart Civil & Architectural Engineering, Intelligent Transportation Systems, and Geographic Information Systems
Emerging Trends in Mechanical and Industrial Engineering
Digital Transformation in Education, Business, Management & Finance
Instructions for Authors
Authors are invited to submit original research works related to the conference tracks. Research papers, survey papers, application and theoretical papers are all welcome. Submitted work should not have been published elsewhere and should not be intended to be published elsewhere during the review period.
All submissions will undergo a Plagiarism and AI Utilization Check before being assigned for blind peer review by members of the Technical Program Committee (TPC). Conference content will be submitted for inclusion into IEEE Xplore. At least one author of an accepted paper is required to register for the conference and present the paper at the conference venue. Non-adherence to this policy will result in the paper being dropped from the Conference Proceeding and will not be submitted to IEEE Xplore. All papers must be submitted electronically through the EDAS conference management platform (https://edas.info/N35157) according to IEEE conference templates. The easiest way to do this is to download and use the IEEE MS Word A4 template or IEEE Latex template (https://www.ieee.org/conferences/publishing/templates.html). All accepted and presented papers will be submitted for inclusion to IEEE Xplore and indexed in Scopus (subject to IEEE approval, Conference Record #71863).
Save the date and come along as we eagerly await the upcoming premier conference. We hope you'll participate in numerous sessions featuring insightful lectures, cutting-edge keynotes by distinguished speakers, and fantastic networking opportunities with industry leaders and top researchers.
Submission Instructions
- All papers must be prepared using the standard IEEE double-column format.
- The manuscript should be between 4 and 6 pages, including references.
- Submissions must be in English.
- Submit your paper via EDAS: https://edas.info/N35157
Strategic Partners
Technical sponsors
